The
LIA Handbook of Laser Materials Processing
Chapter
1 Overview of Laser Materials
Processing
Chapter 2 Lasers for Materials Processing
Chapter 3 Optics and Optical Systems Chapter 3
Chapter 4 Components for Laser Materials Processing Systems
Chapter 5 Laser -Material Interactions
Chapter 6 Hazards and Safety Considerations
Chapter 7 Surface Treatment: Heat Treatment
Chapter 8 Surface Treatment: Glazing, Remelting, Alloying, Cladding, and Cleaning
Chapter 11 Penetration Welding
Chapter 18 Laser Marking/Branding
Chapter 19 Link Cutting/Making
Chapter 21 Applications to Photolithography
Chapter 23 High-Temperature Superconductors
Chapter 24 Laser Produced Microstructures
Chapter 25 Electronic Packaging: Electrical Interconnects
Chapter 26 Electronic Packaging: Package Sealing and Ceramic Processing
Chapter 27 Film Deposition and Doping
Chapter 1 Overview of Laser Materials Processing
1.0 Introduction
1.1 Laser Parameters - Paul Kelley
1.1.1 Laser Beam Parameters
1.1.2 Polarization
1.2 Absorption of Laser Energy - John F. Ready
1.2.1 Reflection
1.2.2 Absorption
1.2.3 Focusing of Laser Light
1.2.4 Laser Damage
1.3 Laser Configurations - John J. Zayhowski
1.3.1 Modal Characteristics - John J. Zayhowski
1.3.2 Temporal Behavior - John J. Zayhowski
1.3.3 Survey of Active Media - John J. Zayhowski
1.3.4 Commercial Lasers for Materials Processing - Marvin Weber
1.4 Laser Systems
1.4.0 Introduction - David A. Belforte
1.4.1 Subsystems - David A. Belforte
1.4.2 Illustrations of Complete Materials Processing Systems - David A. Belforte
1.4.3 Illustrations of Time and Energy-Sharing Systems - Richard J. Coyle and Ronald M. Gagosz
Chapter
2 Lasers for
Materials Processing
2.0 Introduction – John F. Ready
2.1 Carbon Dioxide Lasers
2.1.1 Basic Principles - Jack Davis
2.1.2 Laser Configurations - Jack Davis
2.1.3 Optics - Jack Davis
2.1.4 Power Sources, Accessories and Controls - Jack Davis
2.1.5 Lifetime, Care and Maintenance - Jack Davis
2.1.6 Laser Gases for CO2 Laser Resonators - Joachim Berkmanns
2.2 Nd:YAG Lasers - Thomas R. Kugler
2.2.1 Basic Principles
2.2.2 Laser Configurations
2.2.3 Pump Sources
2.2.4 Power Control
2.2.5 Lifetime, Care and Maintenance
2.2.6 Output Beam Quality
2.3 Other Solid-State Lasers - Stephen A. Payne
2.4 Excimer Lasers
2.4.1 Basic Principles - James Higgins
2.4.2 Wavelengths - James Higgins
2.4.3 Resonator Configurations - James Higgins
2.4.4 Optical Configurations - James Higgins
2.4 5 Power Sources - James Higgins
2.4.6 Lifetime, Care and Maintenance - James Higgins
2.4.7 Gas for Excimer Lasers - Joachim Berkmanns
2.5 Other Lasers
2.5.0 Introduction – John F. Ready
2.5.1 CO Lasers - Tomoo Fujioka
2.5.2 Metal Vapor Lasers - Richard Slagle
2.5.3 Ion Lasers - Kurt G. Klavuhn
2.5.4
Diode Lasers
Introduction to Diode Lasers - Bodo Ehlers
High Power Diode Lasers for Materials Processing - Richard W. Solarz
2.5.5 Iodine Lasers
The Chemical Oxygen Iodine Laser (COIL) - William P. Latham and Aravinda Kar
Photolytic iodine Laser - Philip R. Cunningham and L. A. (Vern) Schlie
2.5.6 Availability of Other Wavelengths with Nonlinear Optics - Ratan Adhav
2.5.7 Free Electron Lasers - John F. Ready
2.5.8 X-Ray Lasers - Pierre Jaegle
2.5.9 Ultrafast Lasers for Materials Processing - M. D. Perry, B. C. Stuart, P. S. Banks, M. D. Feit and J. A. Sefcik
2.6 Water Chiller Considerations for Laser Cooling Applications - Terry I. Armbruster
2.6.0 Introduction
2.6.1 Capacity of Cooling System
2.6.2 Power Requirements
2.6.3 Chiller System Components
2.6.4 Water Issues
Chapter 3 Optics and Optical Systems
3.0 Introduction
3.1 Properties of Laser Beams
3.1.1 Monochromaticity - William P. Latham and Aravinda Kar
3.1.2 Directionality - William P. Latham and Aravinda Kar
3.1.3 Coherence - William P. Latham and Aravinda Kar
3.1.4 Brightness - William P. Latham and Aravinda Kar
3.1.5 Stable Resonator Modes - James T. Luxon
3.1.6 Polarization - James T. Luxon
3.2 Beam Delivery Before Focusing
3.2.0 Introduction
3.2.1 Conventional Beam Delivery - Daniel A. Bakken
3.2.2 Fiber Optic Beam Delivery: Diode Lasers - Chandrasekhar Roychoudhuri
3.2.3 Fiber Optic Beam Delivery: Nd:YAG Lasers - Daniel A. Bakken
3.2.4 Robotic Applications - Daniel A. Bakken
3.3 Focusing and Depth of Focus
3.3.1 Focusing - John F. Ready
3.3.2 Depth of Focus - William P. Latham and Aravinda Kar
3.4
Mode Quality - William P. Latham and Aravinda Kar
Chapter 4 Components for Laser Materials Processing Systems
4.1 Beam Delivery Systems - Marius Jurca
4.1.1 General Remarks on Beam Delivery Systems and Design Criteria
4.1.2 Components for Beam Delivery
4.1.3 Adjustment/Alignment of Beam Delivery Systems
4.2 Focusing Optics
4.2.1 Lenses - Daniel L. Sherman
4.2.2 Mirrors - Daniel L. Sherman
4.2.3 Diffractive Optics - Daniel L. Sherman
4.2.4 Focusing Head and Integrated Actuators - Marius Jurca
4.3 Other Optical Components - Walter J. Spawr
4.3.1 Beam Shaping Optics
4.3.2 Scanners
4.3.3 Beam Splitters
4.3.4 Polarizers
4.3.5 Isolators
4.3.6 Infrared and Ultraviolet Transmitting Materials
4.4 Photodetectors
4.4.1 Basics of Photodetectors - John F. Ready
4.4.2 Commonly Used Detectors - Marius Jurca
4.5 Beam Monitoring and Measurement
4.5.1 Beam Samplers - Francis Audet
4.5.2 Energy Meters - Francis Audet
4.5.3 Power Meters - Francis Audet
4.5.4 Optimizing Meters - Francis Audet
4.5.5 Positioning of Power Monitors - Marius Jurca
4.5.6 Beam Profilers - John F. Ready, Karthnik Nagarathnam and J. Mazumder
4.6 Components for Motion Systems - John F. Ready
4.6.1 Basic Considerations
4.6.2 Guiding Methods
4.6.3 Drivers
4.7 Controllers - David Veverka
4.7.1 Laser and Motion Control
4.7.2 Laser System Control
4.7.3 Programming
4.7.4 CAD/CAM and Off-line Programming
4.8 Process Gas Nozzles
4.8.0 Introduction
4.8.1 Nozzle Configurations - Gary S. Settles
4.8.2 Nozzle Selection - D. W. Moon
4.8.3 Process Gas Nozzles for Cutting - J. Fieret
4.9 Process Monitoring/Sensing Systems
4.9.1 Optical Penetration Sensing - W. W. Duley
4.9.2 Optical Plasma Intensity Monitoring – W. W. Duley
4.9.3 Acoustic Sensing - W. W. Duley
4.9.4 Neural Networks - W. W. Duley
4.9.5 Seam Tracking - W. W. Duley
Evaluation of Seam Tracking Methods – Marius Jurca
4.9.6 Measurement of Keyhole Depth - Marius Jurca
4.9.7
Infrared Monitoring - John F. Ready
Chapter 5 Laser -Material Interactions
5.0 Introduction
5.1 Materials Characteristics - Rolf E. Hummel
5.1.1 Optical Properties
5.1.2 Thermal Properties
5.2 Laser Characteristics
5.2.1 Important Laser Properties - Edward. A. Metzbower
5.2.2 Pulsed Versus CW Characteristics - Edward. A. Metzbower
5.2.3 Focusing Characteristics - Edward. A. Metzbower
5.2.4 Irradiance - Edward. A. Metzbower
5.2.5 Important Lasers for Materials Processing Applications - John F. Ready
5.3 Reflectivity and Absorptivity of Opaque Surfaces - Michael F. Modest
5.3.1 Definitions
5.3.2 Predictions from Electromagnetic Wave Theory
5.3.3 Reflectivities of Metals
5.3.4 Reflectivities in Nonconductors
5.3.5 Polarization Effects
5.3.6 Effects of Surface Conditions
5.3.7 Summary
5.4 Absorption of Laser Radiation
5.4.1 Absorption Coefficients - Michael F. Modest
5.4.2 Semitransparent Sheets - Michael F. Modest
5.4.3 Variation During Irradiation - John F. Ready
5.5 Energy Transport in Irradiated Materials - P. S. Mohanty and Jyoti Mazumder
5.5.1 Introduction
5.5.2 Parameters
5.5.3 Heat Balance
5.5.4 Conduction
5.5.5 Convection
5.5.6 Vaporization
5.5.7 Mass Diffusion
5.5.8 Specific Examples
5.6 Phase Changes - Vladimir Semak
5.7 Plasma Shielding - J. Thomas Schriempf
5.7.0 Introduction
5.7.1 Atmospheric Breakdown
5.7.2 Laser-Supported Absorption Waves
5.7.3 Consequences of Plasma Shielding
5.8
Regimes of Irradiance and Interaction Time - John F. Ready
Chapter 6 Hazards and Safety Considerations
6.0 Introduction
6.1 Health Hazards and Personnel Safety – Terry L. Lyon and Rodney L. Wood and David H. Sliney
6.1.1 Specific Biological Effects
6.1.2 Hazard Classification: Classes of Lasers
6.1.3 Safety Measures
6.2 Laser Welders, Cutters, Heat Treaters, and Punch Presses - Terry L. Lyon and Rodney L. Wood and David H. Sliney
6.2.1 Industrial Laser Systems
6.2.2 Workplace Surveillance
6.3 Specific Systems and Applications
6.3.1 Portable Laser Welders - An Example - Terry L. Lyon and Rodney L. Wood and David H. Sliney
6.3.2 Beam Alignment Hazards - Marius Jurca
6.4 Nonbeam Hazards - LIA Nonbeam Hazard Sub-committee with Additions by C. Eugene Moss
6.4.1 Types of Nonbeam Hazards
6.4.2 Chemical Hazards
6.4.3 Physical Hazards
6.4.4 Personnel Protective Equipment
6.4.5 Biological/Medical Hazards
6.5 Laser Safety Standards – Robert Weiner
6.5.1 Terms and Abbreviations
6.5.2 United States Standards
6.5.3 International Standards
6.5.4 European and Other Nations’ Standards and Directives
6.5.5
Sources
Chapter 7 Surface Treatment: Heat Treatment
7.0 Introduction
7.1 Principles of Transformation Hardening - Charles E. Albright
7.2 Laser and Optics For Heat Treating
7.2.1 Lasers - Wolfgang Bloehs
7.2.2 Optics - Wolfgang Bloehs
7.2.3 Optics For Uniform Beam Profiles - Charles E. Albright
7.3 Results of Laser Heat Treatment
7.3.0 Introduction - Karthik Nagarathnam and Jyoti Mazumder
7.3.1 Irradiance Versus Interaction Time-Karthik Nagarathnam and Jyoti Mazumder
7.3.2 Summary of Laser Heat Treatment Data-Karthik Nagarathnam and Jyoti Mazumder
7.3.3 Effect of Process Variables-Karthik Nagarathnam and Jyoti Mazumder
7.3.4 Residual Stresses in Laser Heat Treatment-Karthik Nagarathnam and Jyoti Mazumder
7.3.5 Laser Heat Treatment Hardness Data-Karthik Nagarathnam and Jyoti Mazumder
7.3.6 Surface Hardening with Diode Lasers - Bodo Ehlers
7.4 Materials and Testing - Hans Wilhelm Bergmann and Klaus Müller
7.4.1 Alloy Effects
7.4.2 Surface Condition
7.5 Surface Properties
7.5.0 Introduction - Leonid F. Golovko
7.5.1 Chemical Composition - Leonid F. Golovko
7.5.2 Hardness and Its Distribution Along the Surface- Leonid F. Golovko
7.5.3 Residual Stresses - Leonid F. Golovko
7.5.4 Residual Deformation - Leonid F. Golovko
7.5.5 Mechanical Characteristics - Leonid F. Golovko
7.5.6 Heat Resistance - Leonid F. Golovko
7.5.7 Corrosion Resistance - Leonid F. Golovko
7.5.8 Wear Resistance - Vivian E. Merchant
7.6 Applications of Heat Treating
7.6.1 Steering Gear Assemblies - David A. Belforte
7.6.2 Diesel Engine Cylinder Liners - David A. Belforte
7.6.3 Turbine Blade Hardening - John F. Ready
7.7 Comparison with Other Technologies - Vivian E. Merchant
7.7.1 Advantages/Disadvantages
7.7.2
Economic Considerations
Chapter 8 Surface Treatment: Glazing, Remelting, Alloying, Cladding, and Cleaning
8.0 Introduction – John F. Ready
8.1 Rapid Melting – John F. Ready
8.1.1 Melting Kinetics – John F. Ready
8.1.2 Absorption Mechanism - M. Bamberger
8.1.3 Effects of Convection - M. Bamberger
8.1.4 Temperature Distribution in the Melt - M. Bamberger
8.2 Rapid Solidification and Microstructure - M. Bamberger
8.2.1 Solidification
8.2.2 Dendrite Spacing
8.3 Appropriate Lasers and Optics – Walter J. Spawr
8.4 Laser Glazing
8.4.1 The Glazing Process – V. E. Merchant
8.4.2 Rapid Cooling – John F. Ready
8.5 Surface Remelting
8.5.1 Surface Remelting of Bearings – Dennis W. Hetzner
8.5.2 Melting Cast-Iron Surfaces – M. Bamberger
8.6 Surface Alloying
8.6.1 Basics of Laser Alloying – John F. Ready
8.6.2 Materials Deposition Techniques – Volodymyr S. Kovalenko
8.6.3 Mixing Characteristics – Volodymyr S. Kovalenko
8.6.4 Enhanced Surface Properties – Volodymyr S. Kovalenko
8.7 Surface Cladding – Thomas Aaboe Jensen
8.7.1 Introduction
8.7.2 Cladding Techniques
8.7.3 Cladding Principles
8.7.4 Process Characteristics
8.7.5 Cladding Characteristics
8.7.6 Cladding Materials
8.7.7 Process Benefits
8.7.8 Process Drawbacks
8.7.9 Applications
8.7.10 Special Applications
8.8 Cleaning
8.8.0 Introduction – Martin. C. Edelson
8.8.1 Surface Cleanings – Martin. C. Edelson
8.8.2 Contaminant Removal – Mary Helen McCay
8.8.3 Removal of Paint, Dielectrics and Other Coatings – Alan E. Hill
8.9 Disk Texturing – Ronald Schaeffer
9.1 Process Definition - E. Schubert, I. Zerner and G. Sepold
9.2 Appropriate Lasers - E. Schubert, I. Zerner and G. Sepold
9.3 Beam Manipulation Techniques - E. Schubert, I. Zerner and G. Sepold
9.4 Applications and Results - E. Schubert, I. Zerner and G. Sepold
9.4.1 Brazing of Steel - E. Schubert, I. Zerner and G. Sepold
9.4.2 Brazing of Titanium - E. Schubert, I. Zerner and G. Sepold
9.4.3 Joining of Dissimilar Materials - E. Schubert, I. Zerner and G. Sepold
9.4.4
Soldering Applications with Diode Lasers - Bodo Ehlers
10.0 Introduction
10.1 Basic Description of Laser Welding
10.1.1 Use of Laser Welding - George Chryssolouris and Stefanos Karagiannis
10.1.2 Metal Reflectivity - Thomas R. Kugler
10.1.3 Thermal Properties of Metals - Thomas R. Kugler
10.1.4 Fusion Front Penetration - Thomas R. Kugler
10.1.5 Thermal Conduction Limitations - Thomas R. Kugler
10.2 Welding Procedures
10.2.1 Laser Characteristics - Thomas R. Kugler
10.2.2 Optics - Thomas R. Kugler
10.2.3 Focus Position - Thomas R. Kugler
10.2.4 Surface Conditions - Thomas R. Kugler
10.2.5 Joint Design: Configurations and Tolerances - Dave F. Farson
10.2.6 Joint Design: Choice -Thomas R. Kugler
10.2.7 Elements of Quality -Thomas R. Kugler
10.2.8 Processing Gases - Joachim Berkmanns
10.2.9 Guidelines - Dave F. Farson
10.3 Laser Welding Results
10.3.1 Nd:YAG Laser Welding - George Chryssolouris and Stefanos Karagiannis
10.3.2 Nd:YAG Laser Welding Guidelines - David Havrilla
10.3.3 Nd:YAG Laser CW Seam Welding of Common Materials - Dale U. Chang
10.3.4 Nd:YAG Pulsed Seam Welding - Thomas R. Kugler
10.3.5 Spot Welding with Pulsed Nd:YAG Lasers - Hansjoerg Rohde
10.3.6 Microjoining with Nd:YAG Lasers - Joseph J. Kwiatkowski
10.3.7 Conduction Welding with CO2 Lasers - John F. Ready
10.3.8 Welding with Low Power CO2 Lasers - John F. Ready
10.3.9 Welding with Diode Lasers - Bodo Ehlers
10.3.10 Welding with Photolytic Iodine Lasers (PILS) - Philip R. Cunningham and L. A. (Vern) Schlie
10.4 Materials Issues
10.4.1 Tabulation of Materials and Weldability - R. F. Duhamel
10.4.2 Welding of Dissimilar Materials - Kevin J. Ely
10.5 Comparison of Laser Welding With Other Technologies
10.5.1 Advantages/Limitations - Vivian E. Merchant
10.5.2 Economic Considerations - Vivian E. Merchant
10.5.3 Comparison of Welding Results
- George Chryssolouris
and Stefanos Karagiannis
Chapter 11 - Penetration Welding
11.0 Introduction – John F. Ready
11.1 Description of Penetration Welding
11.1.1 The Deep Penetration Process – Dan Gnanamuthu
11.1.2 Motion of the Keyhole – John F. Ready
11.1.3 Penetration – John F. Ready
11.1 4 Lasers for Penetration Welding – John F. Ready
11.1.5 Melting Efficiency – John F. Ready
11.2 Welding Procedures - Conrad Banas
11.2.1 Laser Choice
11.2.2 Optics
11.2.3 Focus Position
11.2.4 Surface Conditions
11.2.5 Joint Design
11.2.6 Edge Preparation
11.2.7 Fixturing
11.2.8 Shielding and Plasma Control
11.2.9 Preheating
11.2.10 Spatter Control
11.2.11 Process Monitoring Systems
11.2.12 Post Treatment
11.2.13 Filler Material Considerations
11.3 Welding Data Summary
11.3.1 High-Power Laser Welding of Common Materials – Keng H. Leong and Paul G. Sanders
11.3.2 CO2 Laser CW Seam Welding, Conditions for Penetration Welding – Robert J. Steele
11.3.3 CW CO2 Laser Welding of Common Materials – E. O. Metzbower
11.3.4 Pulsed CO2 Laser Welding of Common Materials – Chris Rickert
11.3.5 Nd:YAG CW Welding of Common Materials – C. L. M. Ireland
11.3.6 Nd:YAG Laser-Pulsed Welding of Common Materials – David C. Weckman and Hugh W. Kerr
11.3.7 Comparison of Penetration Welding with Nd:YAG and CO2 Lasers – David Havrilla
11.3.8 Laser Welding with Filler Wire – Andreas Gebhardt
11.3.9 Welding with Other Lasers – Sunichi Sato
11.3.10 Operating Costs for Penetration Welding – David Havrilla
11.4 Industrial Applications of High-Power Laser Welding
11.4.1 Introduction – Geoff J. Shannon
11.4.2 Key Aspects – Geoff J. Shannon
11.4.3 Welding Thin Sheet Material (< 0.5 mm) – Geoff J. Shannon
11.4.4 Sheet Material (1 – 3 mm) – Geoff J. Shannon
11.4.5 Welding Plate Material (4 – 12 mm) – Geoff J. Shannon
11.4.6 Weld Tolerances – Geoff J. Shannon
11.4.7 Hybrid Welding – Geoff J. Shannon
11.4.8 Weld Testing – Geoff J. Shannon
11.4.9 Plastic Welding – Geoff J. Shannon
11.4.10 Material Welding Summary – Geoff J. Shannon
11.4.11 Laser-Welded Tailored Blanks – Dave F. Farson
11.4.12 Automotive Applications – Andreas Gebhardt
11.5 Comparison of Laser Welding to Other Welding Technologies
11.5.1 Alternate Welding Technologies – Geoff J. Shannon
11.5.2 Key Aspects of Comparison – Geoff J. Shannon.
11.5.3 Laser Welding Comparisons – Dan Gnanamuthu
11.5.4
Comparison of Welding Technology Results - David Havrilla
12.1 Basic Description of Laser Cutting
12.1.1 Cutting Processes - Dirk Petring
12.1.2 Power Balance - Dirk Petring
12.1.3 Appropriate Lasers - Dirk Petring
12.1.4 Gas Assist Techniques - Dirk Petring
12.1.5 Cutting of Complex Shapes - Dirk Petring
12.1.6 Post-Cutting Operations - Dirk Petring
12.1.7 Polarization Effects in Laser Cutting: Basics - Flemming O. Olsen
12.1.8 Control of Beam Polarization Effects in Cutting - John Powell
12.2 Laser Cutting of Metals
12.2.1 The Metal Cutting Process - Leonard Migliore
12.2.2 Characteristics of Laser-Cut Edges - Leonard Migliore
12.2.3 Laser Cutting of Specific Metals - Leonard Migliore
12.2.4 CO2 Laser Cutting of Metals - John Powell
12.2.5 Nd:YAG Laser Cutting - John Powell
Thickness vs Cutting Speed Curves - David Havrilla
12.2.6 Microcutting of Metals with Pulsed Nd:YAG Lasers - Hansjoerg Rohde
12.2.7 Cutting of Metals with Other Lasers
Cutting with a CO Laser - Tomoo Fujioka
Cutting with Chemical Oxygen-Iodine Laser - William P. Latham and Aravinda Kar
Cutting with Photolytic Iodine Lasers – Philip R. Cunningham and L. A. (Vern) Schlie
12.3 Laser Cutting of Nonmetals
12.3.1 Cutting Mechanisms and Cut Quality - John Powell
12.3.2 CO2 Laser Cutting - Volodymyr S. Kovalenko
12.3.3 Cutting of Nonmetals with Nd:YAG Lasers - John Powell
Nd:YAG Laser Cutting Data - Volodymyr S. Kovalenko
12.3.4 Cutting Jewelry Material - David M. Marusa
12.4 Costs of Laser Cutting
12.4.1 Conventional CO2 Laser Cutting System - David Havrilla
12.4.2 Conventional Nd:YAG Laser Cutting System - David Havrilla
12.5 Comparison of Laser Cutting with Other Technologies
12.5.1 Advantages and Drawbacks of Laser Cutting - David Havrilla
12.5.2 Comparison of CO2 Laser Cutting with Other Profiling Techniques - John Powell
12.5.3
Advantages and Limitations of Laser Cutting of Nonmetals - Volodymyr
S. Kovalenko
13.1 Basic Description of Laser Drilling
13.1.1 Surface Reflectivity - Xiangli Chen
13.1.2 Thermal Properties - Xiangli Chen
13.1.3 Physical Processes: Melting, Vaporization, Flushing, Percussion - Xiangli Chen
13.1.4 Appropriate Lasers: Power/Irradiance, Pulse Duration - Xiangli Chen
13.1.5 Percussion Drilling and Treplanning - Dana Elza and Steven R. Maynard
13.2 Drilling of Metals
13.2.0 Introduction
13.2.1 Nd:YAG Laser Drilling - Hansjörg Rohde
13.2.2 CO2 Lasers for Metal Drilling - Marshall G. Jones
13.2.3 CO2 Laser Drilling - Hansörg Rohde
13.2.4 Drilling with Copper Vapor Lasers - Roland Mayerhofer and Hans Wilhelm Bergmann
13.2.5 Applications of Copper Vapor Laser Drilling - Richard Slagle
13.3 Drilling of Nonmetals
13.3.1 General Considerations - Dana Elza and Steven R. Maynard
13.3.2 Nd:YAG Laser Drilling – Suwas Nikumb
13.3.3 CO2 Laser Drilling - Dana Elza and Steven R. Maynard
13.3.4 Excimer Laser Drilling - Heinrich Endert and Dirk Basting
13.3.5 Copper Vapor Laser Drilling - Roland Mayerhofer and Hans Bergmann
13.4 Aerospace Applications - Robert T. Brown
13.4.1 Hole Requirements
13.4.2 Laser Type
13.4.3 Typical Focus-Head Arrangement
13.4.4 Percussion Drilling
13.4.5 Trepan Drilling
13.5 Ultrashort-Pulse Laser Machining - M.D. Perry, B. C. Stuart, P.S. Banks, M.D. Feit, and J.A. Sefcik
13.5.0 Introduction
13.5.1 Dielectrics
13.5.2 Metals
13.6 Comparison With Other Technologies - Todd Rockstroh
13.6.1 Consideration of Quantity of Holes Drilled
13.6.2 Large Diameter Holes, > 0.025mm (0.001 in)
13.6.3 Small Diameter Holes, < 0.025mm (0.001 in)
13.6.4 Laser Costs and Other Factors
13.6.5
Summary
14.1 Basics of Balancing - Hatto Schneider
14.1.0 Introduction
14.1.1 Conditions for Balancing
14.1.2 Balancing Procedures
14.1.3 Balancing Process
14.1.4 Example: A Typical Balancing Task
14.2 Laser Balancing Procedures - Michael Martin
14.2.0 Introduction
14.2.1 Advantages/Limitations of Laser Balancing
14.2.2 Balancing Systems
14.3 Some Applications of Laser Balancing - Hatto Schneider
14.3.1 Timing Wheel Balancing
14.3.2 Clutch Disk Balancing
14.3.3 Frequency Spindle Balancing
14.3.4
Other Applications
15.1 Basic Principles - Terry McKee
15.2 Materials - Terry McKee
15.3 Appropriate Lasers
15.3.1 CO2 Lasers - Robert K. Brimacombe
15.3.2 NdYAG Lasers - Martin Matthews
15.3.3 Excimer Lasers for Marking - Heinrich Endert and Dirk Basting
15.4 Dot Matrix Marking - Andrew John Chambers
15.4.1 Techniques
15.4.2 Results
15.5 Engraving - Peter Becher, Phil DeBoer and Arlene Zdrazil
15.5.1 Techniques
15.5.2 Lasers
15.5.3 Surface Effects
15.5.4 Beam Motion Systems
15.5.5 Masking
15.5.6 Engraving Recommendations
15.6 Image Micromachining - Brian Norris
15.6.1 Techniques
15.6.2 Results
15.7 Applications - Terry Mckee
15.7.1 CO2 Lasers - Terry Mckee
15.7.2 Nd:YAG Lasers - Terry Mckee
15.7.3 Excimer Lasers - Heinrich Endert and Dirk Basting
15.8
Comparison with Other Techniques - Terry Mckee
16.0 Introduction and Glossary – Terry Feeley and Paul F. Jacobs
16.1 Basics of Laser Based Rapid Prototyping- Allan Lightman
16.1.1 Rapid Prototyping: An Overview
16.1.2 Lasers Parameters for RP
16.1.3 Scanning Exposure Factors
16.1.4 Small Spot Systems
16.2 Stereolithography
16.2.1 The Stereolithography Process – Paul F. Jacobs
16.2.2 Materials for Stereolithography - Stephen D. Hanna
16.2.3 Lasers for Stereolithography - Kenneth G. Ibbs
16.2.4 Stereolithography in Product Development - Thomas J. Mueller
16.3 Selective Laser Sintering
16.3.1 The Selective Laser Sintering Process- Brent Stucker
16.3.2 Materials for Selective Laser Sintering -Sundar V. Arte and Randall German
16.3.3 Lasers for Selective Laser Sintering – Damien Gray
16.3.4 Directed Light Fabrication – Gary K. Lewis
16.3.5 The Laser Engineered Net Shaping Process – David M. Keicher
16.3.6 Results – Kevin P. McAlea
16.4 Laminated Object Manufacturing
16.4.1 The LOM Process – Sung S. Pak
16.4.2 Applications – Sung S. Pak
16.4.3 Laser Cutting-Based Rapid Prototyping Options for Metal and Ceramic Components – Curtis W. Griffin and Alair Griffin
16.5 CAM-LEM Processing of Ceramic and Metal Parts – James D. Cawley
16.5.0 Introduction
16.5.1 Material Properties
16.5.2 Machine Variables
16.6 Coating of Rapid Tools by Pulsed Laser Deposition – Larry R. Dosser
16.7 Manufacture of Die Casting Tools by Laser Based RP – Peter J. Hardro
16.8
Table: Comparison of Rapid Prototyping Systems – Peter J. Hardro
17.0 Introduction
17.1 Basics of Laser Trimming - Rodger Dwight
17.1.1 Physical Processes - Rodger Dwight
17.1.2 Overview of a Laser Trimming System - Rodger Dwight
17.1.3 Types of Laser Trims - Rodger Dwight
17.1.4 Appropriate Lasers - Rodger Dwight
17.2 Trimming Techniques - Philip DeLuca
17.2.1 Thick-Film Trimming - Philip DeLuca
17.2.2 Thin Film on Ceramic Laser Trimming - Philip DeLuca
17.2.3 Chip Resistor Laser Trimming - Philip DeLuca
17.2.4 Thin Film on Silicon Resistor Trimming - Philip DeLuca
17.2.5
Interference Effects - Yunlong Sun
Chapter 18 Laser Marking/Branding
18.0 Introduction
18.1 Package Marking and Branding – Donald V. Smart and Jose Downes
18.1.1 Laser Marking in Production
18.1.2 The Marking Process
18.1.3 Mark Quality Criteria
18.2 Wafer Serialization - Jim Scaroni, Jerry Becker and Terry McKee
18.2.1 Techniques
18.2.2 Results
18.3
Marking of Electronic Components - Terry McKee
Chapter 19 Link Cutting/Making
19.0 Introduction Ready
19.1 Basics of Link Processing with Lasers
19.1.0 Introduction – Donald Smart
19.1.1 Basics of Link Cutting – Ready
19.1.2 Memory Repair Goals - Donald Smart
19.1.3 Processing Concerns - Donald Smart
19.1.4 Lasers for Link Cuttig - Donald Smart
19.1.5 Positioning Systems - Donald Smart
19.1.6 Optics - Donald Smart
19.1.7 Pulse Control - Donald Smart
19.1.8 Energy Coupling - Donald Smart
19.1.9 Link Materials - Donald Smart
19.1.10 Link Design - Donald Smart
19.1.11 Link Groups - Donald Smart
19.1.12 Accuracy - Donald Smart
19.1.13 Alignment Strategy - Donald Smart
19.2 Redundancy for Memory Yield Enhancement
19.2.0 Introduction – John F. Ready
19.2.1 Development of Redundancy – Edward J. Swenson
19.2.2 Laser Choice - Edward J. Swenson
19.2.3 Hardware Considerations - Edward J. Swenson
19.2.4 Absorptivity Description - Edward J. Swenson
19.2.5 Spot Size Consideration – James A. Dumestre
19.3 Link Making – Joseph B. Bernstein and Wei Zhang
19.3.0 Introduction
19.3.1 Earlier Work
19.3.2 Principles
19.3.3 Reliability
19.3.4 Implementation
19.3.5 Laser Energy
19.3.6 Summary
19.4 Personalization – Meir Janai
19.4.1 Definitions and Basic Terms
19.4.2 Personalization by Link Cutting - Choice of Laser
19.4.3
The Personalization Process
20.1 Repair Needs - Thomas A. Wassick
20.2 Substrate Repair - Thomas A. Wassick
20.2.1 Repair of Shorts
20.2.2 Repair of Opens
20.3
Laser-Based Photomask Repair - John F. Ready
Chapter 21 Applications to Photolithography
21.1 Overview – J. J. Dubowski
21.2 Laser Sources for Microlithography Exposure Tools - Toshihiko Ishihara
21.2.1 Excimer Lasers - Toshihiko Ishihara
21.2.2 Diode Pumped Harmonic Nd:YAG Lasers - Roy D. Mead
21.3 Advantages of Laser Microlithography Compared to Other Sources - John J. Shamaly
21.4 Laser Based Photolithography System Issues - John J. Shamaly
21.5 Deep Ultraviolet Laser Photolithography – Timothy A. Brunner
21.5.1 Overview
21.5.2 High Resolution Lithography
21.5.3
Deep Ultraviolet Lithography Issues
22.0 Introduction
22.1 Repair - Floyd R. Pothoven
22.1.1 Short Removal
22.1.2 Open Repair
22.2 Marking - Floyd R. Pothoven
22.3 Laser Patterning Indium Tin Oxide Coated Flat Panel Displays - Rodney Waters and Terry Pothoven
22.3.1 Nature of Indium Tin Oxide
22.3.2 Maskless Pattern Generation
22.3.3 Laser Choices
22.3.4 Laser Cutting
22.4
Annealing of Thin-Film Transistors - Heinrich Endert and Dirk Basting
Chapter 23 High-Temperature Superconductors (HTSC)
23.0 Introduction
23.1 Procedures - S. P. Pai, R. D. Vispute and T. Venkatesan
23.1.1 Targets and Ablation
23.1.2 Appropriate Lasers and Systems
23.1.3 Film Growth
23.2 Results of HTSC Deposition - Quanxi Jia
23.2.1 Characterization
23.2.2 Comparison with Other Techniques
23.3 Laser Treatment of HTSC Films - Emil N. Sobol
23.3.1 Modification
23.3.2
Polishing of Thin HTSC Films
Chapter 24 Laser Produced Microstructures
24.0 Introduction J. J. Dubowski
24.1 Basic Laser Microstructuring Procedures J. J. Dubowski
24.1.1 Microstructuring by Laser Ablation
24.1.2 Microstructuring by Laser Etching
24.2 Other Methods of Laser Microstructuring J. J. Dubowski
24.2.1 Laser-LIGA Processing
24.2.2 Laser Microstructuring of Glass
24.2.3
Laser Microstructuring of Semiconductors
Chapter 25 Electronic Packaging: Electrical Interconnects
25.0 Introduction
25.1 Via Drilling - Mark D. Owen
25.1.1 Lasers for Via Drilling
25.1.2 Optical Configurations
25.1.3 Applications and Results
25.2 Bonding/Soldering
25.2.1 Laser Tape Automated Bonding (TAB) - James Hayward
25.2.2 Laser Reflow Soldering - Gary M. Freedman
25.3 Wirestripping
25.3.0 Introduction
25.3.1 Important Parameters in Laser Wirestripping – James H. Brannon and Andrew C. Tam
25.3.2 Lasers for Wirestripping – James H. Brannon and Andrew C. Tam
25.3.3
Wirestripping Procedures - Ronald D. Schaeffer
Chapter 26 Electronic Packaging: Package Sealing and Ceramic Processing
26.0 Introduction
26.1 Package Welding - Phillip W. Fuerschbach
26.1.1 General Considerations
26.1.2 Weld Schedule Development
26.1.3 Process Monitoring
26.2 Cutting and Scribing of Substrates – Steven R. Maynard
26.2.0 Introduction
26.2.1 Laser Selection
26.2.2 Process Parameters
26.2.3 Pulse Parameters
26.2.4 Optical Considerations
26.2.5 Assist Gas and Nozzle Configuration
26.2.6 Hardware Considerations
26.2.7 Comparison of Scribing and Cutting
26.2.8 Laser Scribing Results
26.3 Hole Drilling in Ceramics
26.3.0 Introduction
26.3.1 Advantages and Laser Choice - Ronald D. Schaeffer
26.3.2
Procedures and Results - William Shiner and Steve Maynard
Chapter 27 Film Deposition and Doping
27.1 Thin Film Deposition – Y. Y. Tsui
27.1.1 Laser Chemical Vapor Deposition
27.1.2 Coatings made by LCVD
27.1.3 Direct Write Processing using LCVD
27.1.4 Pulsed Laser Deposition
27.2 Deposition of Thick Films of Electronic Ceramics - D. B. Chrisey, J. S. Horwitz, P. C. Dorsey and L. A. Knauss
27.3 Gas Immersion Laser Doping (GILD) Michael O. Thompson, Thomas Sigmon and Patrick M. Smith
27.3.1 Theory of Operation
27.3.2 GILD Equipment and Sample Preparation
27.3.3 Laser Sources
27.3.4 Gas Sources
27.3.5 Process Monitoring and Calibration
27.3.6 Doping Profiles
27.3.7
Wafer Throughput